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CYStech Electronics Corp.
General Purpose PNP Epitaxial Planar Transistor
Spec. No. : C306A3 Issued Date : 2003.07.14 Revised Date : 2005.01.03 Page No. : 1 / 5
BTA733A3
Description
* The BTA733A3 is designed for use in driver stage of AF amplifier and general purpose amplification. * High HFE and excellent linearity * Complementary to BTC945A3. * Pb-free package
Symbol
BTA733A3
Outline
TO-92
BBase CCollector EEmitter
ECB
Absolute Maximum Ratings (Ta=25C)
Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Base Current Power Dissipation Thermal Resistance, Junction to Ambient Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC IB Pd RJA Tj Tstg Limits -60 -50 -5 -100 -20 625 200 150 -55~+150 Unit V V V mA mA mW C/W C C
BTA733A3
CYStek Product Specification
CYStech Electronics Corp.
Characteristics (Ta=25C)
Symbol BVCEO ICBO IEBO *VCE(sat) VBE hFE fT Cob Min. -50 -0.58 135 100 Typ. Max. -0.1 -0.1 -0.3 -0.68 600 6 Unit V A A V V MHz pF
Spec. No. : C306A3 Issued Date : 2003.07.14 Revised Date : 2005.01.03 Page No. : 2 / 5
Test Conditions IC=-1mA VCB=-60V VEB=-5V IC=-100mA, IB=-10mA VCE=-6V, IC=-1mA VCE=-6V, IC=-1mA VCE=-6V, IC=-10mA VCB=-10V, f=1MHz
*Pulse Test: Pulse Width 380s, Duty Cycle2%
Classification Of hFE
Rank Range Q 135~270 P 200~400 K 300~600
BTA733A3
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Current Gain vs Collector Current
1000
HFE@VCE=6V
Spec. No. : C306A3 Issued Date : 2003.07.14 Revised Date : 2005.01.03 Page No. : 3 / 5
Saturation Voltage vs Collector Current
1000 Saturation Voltage---(mV)
Current Gain---HFE
VCE(SAT)@IC=10IB
100
100
10 0.1 1 10 100 1000 Collector Current---IC(mA)
10 0.1 1 10 100 1000 Collector Current---IC(mA)
Saturation Voltage vs Collector Current
10000
VBE(SAT)@IC=10IB
Cutoff Frequency vs Collector Current
1 Cutoff Frequency---FT(GHZ)
Saturation Voltage---(mV)
1000
FT@VCE=12V
100 0.1 1 10 100 Collector Current---IC(mA) 1000
0.1 1 10 Collector Current---IC(mA) 100
Power Derating Curve
700
Power Dissipation---PD(mW)
600 500 400 300 200 100 0 0 50 100 150 200 Ambient Temperature --- Ta( )
BTA733A3
CYStek Product Specification
CYStech Electronics Corp.
TO-92 Taping Outline
Spec. No. : C306A3 Issued Date : 2003.07.14 Revised Date : 2005.01.03 Page No. : 4 / 5
H2
H2
H2A H2A A
D2
H3
L
H4 H L1 H1 F1F2 D1
D
W1 W
T2 T T1
P1
P
P2
DIM A D D1 D2 F1,F2 F1,F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 BTA733A3
Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch
Millimeters Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 253 Max. 4.83 4.20 0.53 4.83 2.90 0.3 16.50 9.50 1 1 27 21 11 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 255
CYStek Product Specification
CYStech Electronics Corp.
TO-92 Dimension
Spec. No. : C306A3 Issued Date : 2003.07.14 Revised Date : 2005.01.03 Page No. : 5 / 5
A B
1 2 3
2
Marking:
A733
3
C
D
H I E F
G
1
Style: Pin 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package CYStek Package Code: A3
*: Typical
DIM A B C D E F
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
DIM G H I 1 2 3
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
* Lead: 42 Alloy ; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTA733A3
CYStek Product Specification

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